In a world where artificial intelligence is rapidly advancing, Samsung stands at the forefront, revolutionizing memory solutions to meet the growing demands of the AI era. Let’s dive into the transformative capabilities and cutting-edge innovations that Samsung is bringing to the table.

Redefining the Landscape of AI Technologies

The impact of AI on our daily lives is undeniable. From boosting productivity in workplaces to enhancing convenience in our homes through services like ChatGPT, AI is reshaping our reality. Samsung acknowledges this paradigm shift and is actively integrating on-device AI into smartphones, computers, and automobiles, driven by the need for enhanced security and responsiveness.

Navigating the Cloud with AI Innovations

In the heart of AI-related computational processing lies data centers, the backbone of seamless services provided by platforms like ChatGPT and Bing Chat. Samsung recognizes the challenges of bottlenecking in data centers, hindering GPU utilization due to insufficient memory bandwidth. Addressing this, Samsung offers optimized solutions for cloud applications.

HBM3E Shinebolt: Pushing the Limits

HBM3E takes center stage as the go-to memory for AI, utilizing Samsung’s 12-layer stacking technology. With a bandwidth of up to 1,280GBps and a capacity reaching 36GB, HBM3E outperforms its predecessor by over 50%, catering to the demands of the Hyperscale AI era.

32Gb DDR5 DRAM: Redefining Possibilities

Samsung’s groundbreaking 32Gb DDR5 product, developed on a 12nm-class process, paves the way for high-capacity modules. Supporting up to 1TB with improved power consumption and data transfer speeds of up to 7.2Gbps, DDR5 32Gb emerges as a core solution for generative AI in high-capacity servers.

MRDIMM: Doubling the Performance

Samsung introduces MRDIMM5, doubling data transmission channels and supporting a speed of 8.8 GB/s. Tailored for AI applications requiring high-performance memory, MRDIMM products leverage 32GB of DDR5, promising a superior performance, capacity, and power efficiency lineup.

PM9D3a: Revolutionizing SSDs

The PM9D3a SSD, based on an 8-channel controller supporting PCIe 5.0, boasts a sequential read speed improvement of up to 2.3 times. With products ranging from 7.68TB to 30.72TB, Samsung envisions these SSDs in new server systems, promising high-performance storage experiences.

Empowering On-Device AI with High-Performance, Low-Power Solutions

Implementing AI services on devices demands high-performance, high-capacity memory. Samsung introduces solutions tailored for on-device AI, ensuring swift processing and response times.

LPDDR5X DRAM: Speed Meets Efficiency

Samsung’s LPDDR5X product, based on the LPDDR7 standard, achieves data transfer speeds of up to 9.6Gbps. Leveraging High-K/Metal Gate (HKMG) technology, it improves power efficiency by 30%, offering standard packaging solutions optimized for various applications.

LPDDR5X CAMM2: Redefining DRAM in PCs and Laptops

In a leap forward, Samsung introduces the LPDDR5X CAMM2, a game-changer in the PC and laptop DRAM market. With a speed of 7.5 GHz, Samsung explores applications in AI, HPC, servers, data centers, and beyond, collaborating closely with major customers.

LLW DRAM: Instant Responses with Ultra-High Performance

Low Latency Wide I/O (LLW) DRAM, optimized for low latency and ultra-high performance of 128 GB/s, proves ideal for on-device AI. Operating with a shallow power draw, it ensures instant responses crucial for on-device AI operations.

PM9E1: Fast-Tracking Language Models

Scheduled for development in June, the PM9E1 SSD for PC/client OEMs, supporting PCIe 5.0, promises a sequential read speed twice as fast. With a 33% improvement in power efficiency, it emerges as a key player in transferring large language models to DRAM in less than a second.

Revolutionizing Automotive Memory by 2025

As autonomous driving evolves, Samsung anticipates the shift from a distributed to a centralized structure in-vehicle systems. Addressing the need for high-performance and high-capacity memory, Samsung introduces groundbreaking solutions for automotive applications.

Detachable AutoSSD: Pioneering Automotive Memory

Samsung unveils the world’s first detachable SSD for automotive applications. With capacity improvements from 1TB to 4TB and a significant boost in random write speed, this product leads the way in automotive memory solutions. Samsung engages in discussions with major automobile manufacturers, aiming to complete Proof of Concept (PoC) technical verification in the first quarter of this year.

Building Foundations for the Future

Samsung’s commitment to staying ahead in the ever-evolving semiconductor market is evident through strategic initiatives and forward-looking planning.

Memory Product Planning Office: A Unified Approach

Samsung establishes the Memory Product Planning Office, acting as an “Expert Organization of Business Coordinators.” By unifying multiple departments, Samsung enhances its responsiveness to technology trends, rapid changes, and individualized customer needs.

Future Solutions and New Businesses

The explosive growth of AI demands continuous innovation in-memory solutions. Samsung envisions advancements in DDR6, HBM4, GDDR7, PCIe 6.0, LPDDR6, and UFS 5.012 to support higher-performance systems. By exploring new interfaces and stacking technologies like CMM and computational memory, Samsung leads the charge in transforming the memory paradigm.

Custom HBM DRAM: Tailoring to Customer Needs

Samsung collaborates closely with major data center customers and CPU/GPU leaders to address specific demands for HBM. The custom HBM DRAM becomes the key to innovation in-memory technology, overcoming technological limitations, and responding to individualized needs.

CMM: Leading the AI Era

CMM-D13 expands bandwidth and capacity, catering to next-generation computing markets. Samsung’s CMM-D technology, developed in May 2021, sets industry benchmarks, with plans to collaborate on a robust CXL memory ecosystem.

PIM: A Shift in Memory Paradigm

PIM14 emerges as a next-generation convergence technology, enhancing energy efficiency for AI accelerator systems by reducing data transfer between the CPU and memory. Samsung accelerates the commercialization of HBM-PIM for AI accelerators and LPDDR-PIM for on-device AI.

PBSSD as a Service: Innovative SSD Subscription Model

“PBSDD as a Service” introduces a unique business model, providing high-capacity SSD subscription services instead of traditional server configurations. This model aims to lower initial investment and maintenance costs for customers’ storage infrastructure.

Global Partnerships for Continuous Innovation

Recognizing the vast potential of semiconductor growth, Samsung emphasizes the importance of global partnerships. The Samsung Memory Research Center (SMRC) is a collaborative platform for customers, enabling the analysis of optimal hardware and software combinations for servers.

TECx: Elevating Technical Support

Samsung’s Technology Enabling Center (TEC) expands its reach with TECx, offering near-site technical support in key locations worldwide. This extension enhances customer relationship management and facilitates immediate technical support, fostering closer technological collaborations.

In 2024, the semiconductor market will undergo unprecedented transformations, and Samsung, as a leader in future memory technology, will embrace bold challenges with relentless innovation and unwavering partnerships. With an eye on optimization for the AI era, Samsung is set to shape the future of memory solutions.

Conclusion: Samsung’s Commitment to Optimizing the AI Era

As the semiconductor market undergoes rapid transformations, Samsung remains at the forefront, committed to innovation and global partnerships. With a diversified portfolio and a keen eye for emerging technologies, Samsung is poised to shape the AI era and optimize it for all.